SHINKO
Corporate Name SHINKO ELECTRIC INDUSTRIES CO.,LTD. Address [Head office] 80, Oshimada-machi, Nagano-shi, 381-2287 Japan President Mamoru Kuroiwa Date of Establishment September 12, 1946 Fiscal Year Ending March 31 Major Business Lines Manufacturing and Sales of Plastic Laminated Package(PLP), Tape BGA, Lead Frame, Glass-to-Metal Seals, Electro Static Chuck, Precision Contact Parts, Surge Arrester, IC Assembly, Multi Chip Package(MCP),Wafer Level Package(WLP) and System Module
Rigid Substrate [P-BGA Substrate] Build-up Substrate Flexible Substrate [Tape BGA] Lead Frame Multilayer Lead Frame P-VQFN Rivetting Pd-P.P.F SFP-LF Open Tool Standard Package (FBGA/FLGA) System in Package Stacked-FBGA(MCP) PoP [Package on Package] Device Embedded Package [MCeP?] Module assembly Module assembly Camera Module assembly Test service Glass-to-Metal Seals Ceramic Package Metal Wall Package RF Ceramic Package Heat Spreader Electro Static Chuck Metal Dome Surge Protective Device SSG(SHINKO Switching Gap) *Indications inside [ ] show the names of the Company’s products. *Indications inside ( ) show an alternative name or the unabbreviated name.
